OSHA Inspection: TECCOR ELECTRONICS, INC.

Issued

Oct 5, 1995

Abate by

Oct 25, 1995

Penalty

Initial $7,000 · Current $500 Reduced

Hazardous substances 1903249022602590

Issued

Oct 5, 1995

Abate by

Oct 25, 1995

Penalty

Initial $7,000

Hazardous substances 1903249022602590

Issued

Oct 5, 1995

Abate by

Oct 25, 1995

Hazardous substances 1903249022602590

Issued

Oct 5, 1995

Abate by

Oct 25, 1995

Penalty

Initial $7,000

Hazardous substances 1903249022602590

Issued

Oct 5, 1995

Abate by

Oct 18, 1995

Penalty

Initial $7,000

Hazardous substances 1903249022602590

Issued

Oct 5, 1995

Abate by

Oct 18, 1995

Penalty

Initial $7,000 · Current $500 Reduced

Hazardous substances 1903

Issued

Oct 5, 1995

Abate by

Oct 18, 1995

Hazardous substances 1903

Issued

Oct 5, 1995

Abate by

Oct 18, 1995

Penalty

Initial $7,000 · Current $500 Reduced

Hazardous substances 1903

Issued

Oct 5, 1995

Abate by

Oct 18, 1995

Penalty

Initial $70,000 · Current $27,000 Reduced

Hazardous substances 1903

General-duty citation text

SECTION 5(a)(1) of the Occupational Safety and Health Act of 1970:  The
employer did not
furnish employment and a place of employment which were free from
recognized hazards that
were causing or likely to cause death or serious physical harm to
employees in that employees
were exposed to:
At the clean-up room, where employees were exposed to the hazard of
exposure to toxic
gas(es) resulting from the mixing of incompatible chemicals.  Conditions
which could
result in the mixing of such incompatible substances were not controlled
in that:
(a)The floor below the grating in the cleanup room was heavily littered
with silicon
wafers, had been in this condition for more than a year prior to the
incident and
continued to be littered even after the event.  Silicon wafers can react
with
concentrated acid to form the toxic gas nitrogen dioxide.
(b)The demonstrated potential for leaks from the pump for the Probetronics
Etching
machine, located above the grating and floor where silicon wafers were
allowed
to accumulate, was not controlled.  The pump was used to supply
concentrated
acids to the etching process.
The potential for hazardous release of toxic gas through the mixing of
these incompatible
chemicals was demonstrated during an incident on or about April 7, 1995.
At that time
a visible brown cloud of nitrogen dioxide, which can cause pulmonary edema
and
permanent lung damage, rose above the grating into the work area.  Exposed
employees
required medical treatment.
Recognized and feasible means of abatement for this hazard include, but
are not limited
to, the following:
(1)Develop and implement a housekeeping program with scheduling for wafer
removal at sufficient intervals to prevent the accumulation of silicon
material at
the floor.
(2)Install and operate a leak detection system for the pump set-up.
(3)Install a leak containment and drainage system such that any leaks of
acid are
contained and diverted from wafer materials.  Develop and implement an
associated pump/containment maintenance program to prevent leaks from
occurring.